References
- Liang S., Wang X., Wang L. : Fabrication of CuW pseudo alloy by W–CuO nanopowders’, J. Alloys Compd, 2012, 516, 161–166.
- Yasar I., Canakci A. and Arslan F.: ‘The effect of brush spring pressure on the wear behaviour of copper–graphite brushes with electrical current’, Tribol. Int., 2007, 40, (9), 1381–1386.
- Wang M., Zhang Y., Huang D. and Liu X.: ‘Numerical simulation of upsetting-extruding process of dispersion strengthened copper welding electrode’, Trans. Nonferr. Met. Soc. China, 2007, 17, (3), 449–454.
- Tian B., Liu P., Song K., Li Y., Liu Y., Ren F. and Su J.: ‘Microstructure and properties at elevated temperature of a nano-Al2O3 particles dispersion-strengthened copper base composite’, Mater. Sci. Eng. A, 2006, A435–A436, 705–710.
- Vaidya R. U. and Chawla K. K.: ‘Thermal expansion of metal–matrix composites’, Compos. Sci. Technol., 1994, 50, (1), 13–22.
- Wang X., Liang S., Yang P. and Fan Z.: ‘Effect of milling time on electrical breakdown behavior of Al2O3/Cu composite’, J. Mater. Eng. Perform., 2010, 19, (6), 906–911.
- Ke Xing Song X. H. G., Wang Y. P. and Wang Q.: ‘Wear behavior of Cr2O3/Cu composite under electrical sliding’, Adv. Mater. Res., 2010, 97–101, 861–866.
- Liang S., Wang X., Fang L.: ‘Relationship between powder characteristic and internal oxidation of Al in Cu–Al pre-alloyed powders’, Acta Metall. Sinica, 2009, 22, (1), 71–80.
- Akhtar F., Askari S. J., Shah K. A., Du X. and Guo S.: ‘Microstructure, mechanical properties, electrical conductivity and wear behavior of high volume TiC reinforced Cu–matrix composites’, Mater. Charact., 2009, 60, (4), 327–336.
- Tjong S. C. and Lau K. C.: ‘Abrasive wear behavior of TiB2 particle-reinforced copper matrix composites’, Mater. Sci. Eng. A, 2000, A282, (1–2), 183–186.
- Arsenault R. J. and Taya M.: ‘Thermal residual stress in metal matrix composite’, Acta Metall., 1987, 35, (3), 651–659.
- Yan Y., Geng L.. Effects of particle size on the thermal expansion behavior of SiCp/Al composites’, J. Mater. Sci., 2007, 42, (15), 6433–6438.
- Groza J. R. and Gibeling J. C.: ‘Principles of particle selection for dispersion-strengthened copper’, Mater. Sci. Eng. A, 1993, A171, (1–2), 115–125.
- Xiu Hua Guo K. X. S., Liang S. H., Wang Q. and Wang Y. P.: ‘Effect of electrical current on wear rate of nano-Al2O3p/Cu composite’, Adv. Mater. Res., 2010, 97–101, 717–723.
- Wu J. Y., Zhou Y. C. and Wang J. Y.: ‘Tribological behavior of Ti2SnC particulate reinforced copper matrix composites’, Mater. Sci. Eng. A, 2006, A422, (1–2), 266–271.
- Shu K.-M and Tu G. C.: ‘The microstructure and the thermal expansion characteristics of Cu/SiCp composites’, Mater. Sci. Eng. A, 2003, A349, (1–2), 236–247.
- Elomari S., Boukhili R. and Lloyd D. J.: ‘Thermal expansion studies of prestrained Al2O3/Al metal matrix composite’, Acta Mater., 1996, 44, (5), 1873–1882.
- Wan Y. Z., Wang Y. L., Luo H. L. : ‘Effect of particle size on thermal expansion behavior of Al2O3–copper alloy composites’, J. Mater. Sci. Lett., 1999, 18, (13), 1059–1061.
- Guo X., Song K., Liang S. and Zheng C.: ‘Thermal expansion behavior of MgO/Cu composite with lower MgO volume fraction’, Mater. Res. Bull., 2012, 47, (11), 3211–3215.
- Broyles S., Anderson K., Groza J. and Gibeling J. C.: ‘Creep deformation of dispersion-strengthened copper’, Metall. Mater. Trans. A, 1996, 27A, (5), 1217–1227.
- Ibrahim I. A., Mohamed F. A. and Lavernia E. J.: ‘Particulate reinforced metal matrix composites – a review’, J. Mater. Sci., 1991, 26, (5), 1137–1156.
- Ardell A. J.: ‘The effect of volume fraction on particle coarsening: theoretical considerations’, Acta Metall., 1972, 20, (1), 61–71.
- Adachi J., Kurosaki K., Uno M. and Yamanaka S.: ‘Effect of porosity on thermal and electrical properties of polycrystalline bulk ZrN prepared by spark plasma sintering’, J. Alloys Compd, 2007, 432, (1–2), 7–10.
- Hunter O. and Brownell W. E.: ‘Thermal expansion and elastic properties of two-phase ceramic bodies’, J. Am. Ceram. Soc., 1967, 50, (1), 19–22.
- Liang S., Fang L. and Fan Z.: ‘Internal oxidation of Cr in Cu–Cr/Cu2O composite powder prepared by mechanical activation’, Mater. Sci. Eng. A, 2004, A374, (1–2), 27–33.
- Ren Xuping W. X. and Li H.: ‘The relationship of thermal expansion and yield stress of materials’, Chin. Sci. Bull., 1991, (10), 788–790.
- Jun W.: ‘Microstructure of pure copper in continuous extrusion process’, Dalian Jiaotong University, Dalian, China, 2009.