References
- I N Jeong, K J Kim, T O Kong, J S Kim, H K Choi, and C M Nam, et al., “High performance RF integrated passive devices on thick oxide substrate using Cu?BCB process” Microwave and Optical Technology Letters, vol. 37, no. 1, pp. 49–52, Feb. 2003.
- S M Wu, W Y Lin, K Y Wang, C H Huang, and W K Yeh, “The high balance symmetric balun for WLAN and WiMAX application using the integrated passive device (IPD) technology” IEEE International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China, pp. 14–17, Aug. 2009.
- C Wang, and N Y Kim, “Fabrication of metal-insulator-metal capacitors with SiN thin films deposited by plasma-enhanced chemical vapor deposition” Transactions on Electrical and Electronic Materials, vol. 10, no. 5, pp. 147–51, Oct. 2009.
- C Wang, W S Lee, F Zhang, and N Y Kim, “A novel method for the fabrication of integrated passive device on SI-GaAs substrate” The International Journal of Advanced Manufacturing Technology, vol. 52, no. 9, pp.1011–8, Mar. 2011.
- V Govind, P Monajemi, L Carastro, S Lapushin, C Russell, and S Dalmia, et al., “Design of novel highly integrated passive devices for digital broadcasting satellite/802.11 home networking solution in liquid crystal polymer (LCP)?based organic substrates“ IEEE MTT?S International Microwave Symposium Digest, San Francisco, CA, USA, pp. 1157–60, Jun. 2006.
- K Liu, and R C Frye, “Full-circuit design optimization of a RF silicon integrated passive device” IEEE 15th Topical Meeting on Electrical Performance of Electronic Packaging, Scottsdale, AZ, USA, pp. 327–30, Oct. 2006.
- J W Jung, K K Nae, J Kim, and J S Park, “RF-IPD directional coupler for mobile RFID handset applications” Electronics Letters, vol. 43, no. 13, pp. 719–20, Jun. 2007.
- K Liu, and R C Frye, “Small form-factor integrated passive devices for SiP applications” IEEE MTT-S International Microwave Symposium Digest, Honolulu, HI, USA, pp. 2117–20, Jun. 2007.
- K Liu, R Emigh, and R C Frye, “Small form-factor integrated balun with complex impedance matching” IEEE MTT-S International Microwave Symposium Digest, Atlanta, GA, USA, pp. 1239–42, Jun. 2008.
- R B Bass, J Z Zhang, W L Bishop, A W Lichtenberger, and S KPan, “Beam lead Quartz chips for superconducting millimeter-wave circuits” SPIE, Millimeter and Sub-millimeter Detectors for Astronomy, vol. 4855, pp. 415–26, Feb. 2003.
- H Jiang, Y Wan, J L A Yeh, and N C Tien, “Fabrication of high-performance on-chip suspended spiral inductors by micromachining and electroless copper plating” IEEE MTT-S International Microwave Symposium Digest, Boston, MA, USA, pp. 279–82, Jun. 2000.
- L I Parad, and R L Moynihan, “Split-Tee power divider” IEEE Transactions on Microwave Theory and Techniques, vol. 13, no. 1, pp. 91–5, Jan. 1965.
- S B Cohn, “A class of broadband three-port TEM-mode hybrids” IEEE Transactions on Microwave Theory and Techniques, vol. 19, no. 2, pp. 110–6, Feb. 1968.
- A A M Saleh, “Planar electrically symmetric n-way hybrid power divider/combiners” IEEE Transactions on Microwave Theory and Techniques, vol. 28, no. 6, pp. 555–63, Jan. 1980.