Journal of Adhesion Science and Technology, Volume 22, Issue 14 (2008)

Browse this journal
Sample our Physical Sciences journals, sign in here to start your FREE access for 14 days

Journal of Adhesion Science and Technology, Volume 22, Issue 14 (2008)

See all volumes and issues
Vol 38, 2024 Vol 37, 2023 Vol 36, 2022 Vol 35, 2021 Vol 34, 2020 Vol 33, 2019 Vol 32, 2018 Vol 31, 2017 Vol 30, 2016 Vol 29, 2015 Vol 28, 2014 Vol 27, 2013 Vol 26, 2012 Vol 25, 2011 Vol 24, 2010 Vol 23, 2009 Volume 22, 2008 Vol 21, 2007 Vol 20, 2006 Vol 19, 2005 Vol 18, 2004 Vol 17, 2003 Vol 16, 2002 Vol 15, 2001 Vol 14, 2000 Vol 13, 1999 Vol 12, 1998 Vol 11, 1997 Vol 10, 1996 Vol 9, 1995 Vol 8, 1994 Vol 7, 1993 Vol 6, 1992 Vol 5, 1991 Vol 4, 1990 Vol 3, 1989 Vol 2, 1988 Vol 1, 1987
Download citations Download PDFs Download issue

Electrically Conductive Adhesives Part II

Articles

Article
Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging
Myung Jin Yim, Yi Li, Kyoung-sik Moon, Kyung Wook Paik & C. P. Wong
Pages: 1593-1630
Published online: 02 Apr 2012
AbstractforReview of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging | References | PDF (2.9 MB)
  • 1566 Views
  • 133 CrossRef citations
  • 0Altmetric
Article
Reliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging Applications
Y. C. Lin & X. Chen
Pages: 1631-1657
Published online: 02 Apr 2012
AbstractforReliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging Applications | References | PDF (750.2 KB)
  • 203 Views
  • 21 CrossRef citations
  • 0Altmetric
Article
Aspect Ratio and Loading Effects of Multiwall Carbon Nanotubes in Epoxy for Electrically Conductive Adhesives
Jing Li, Janet K. Lumpp, Rodney Andrews & David Jacques
Pages: 1659-1671
Published online: 02 Apr 2012
AbstractforAspect Ratio and Loading Effects of Multiwall Carbon Nanotubes in Epoxy for Electrically Conductive Adhesives | References | PDF (2.3 MB)
  • 116 Views
  • 10 CrossRef citations
  • 0Altmetric
Article
Electrical Properties of Copper-Filled Electrically Conductive Adhesives and Pressure-Dependent Conduction Behavior of Copper Particles
Yung-Sen Lin & Sheng-Shiang Chiu
Pages: 1673-1697
Published online: 02 Apr 2012
AbstractforElectrical Properties of Copper-Filled Electrically Conductive Adhesives and Pressure-Dependent Conduction Behavior of Copper Particles | References | PDF (3.1 MB)
  • 144 Views
  • 24 CrossRef citations
  • 0Altmetric
Article
Drop Test Performance of Isotropic Electrically Conductive Adhesives
James E. Morris & Jeahuck Lee
Pages: 1699-1716
Published online: 02 Apr 2012
AbstractforDrop Test Performance of Isotropic Electrically Conductive Adhesives | References | PDF (3.1 MB)
  • 45 Views
  • 4 CrossRef citations
  • 0Altmetric
Article
Experimental Investigation and Micropolar Modelling of the Anisotropic Conductive Adhesive Flip-Chip Interconnection
Yan Zhang, Johan Liu, Ragnar Larsson & Itsuo Watanabe
Pages: 1717-1731
Published online: 02 Apr 2012
AbstractforExperimental Investigation and Micropolar Modelling of the Anisotropic Conductive Adhesive Flip-Chip Interconnection | References | PDF (1.7 MB)
  • 38 Views
  • 2 CrossRef citations
  • 0Altmetric
Article
Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part I: Durability of Anisotropically Conductive Adhesive Interconnects
J. Haase, D. Farley, P. Iyer, P. Baumgartner, A. Dasgupta & J. F. J. Caers
Pages: 1733-1756
Published online: 02 Apr 2012
AbstractforMechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part I: Durability of Anisotropically Conductive Adhesive Interconnects | References | PDF (6.7 MB)
  • 72 Views
  • 5 CrossRef citations
  • 0Altmetric
Article
Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part II: Effect of Bump Coplanarity on Manufacturability and Durability of Non-Conducting Adhesive Assemblies
D. Farley, A. Dasgupta & J. F. J. Caers
Pages: 1757-1780
Published online: 02 Apr 2012
AbstractforMechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part II: Effect of Bump Coplanarity on Manufacturability and Durability of Non-Conducting Adhesive Assemblies | References | PDF (1.5 MB)
  • 61 Views
  • 9 CrossRef citations
  • 0Altmetric
Article
Temperature Characterization in Anisotropic Conductive Film Adhesive Bonding
Robert L. D. Zenner, Cameron T. Murray & Carl Fisher
Pages: 1781-1797
Published online: 02 Apr 2012
AbstractforTemperature Characterization in Anisotropic Conductive Film Adhesive Bonding | References | PDF (1.2 MB)
  • 53 Views
  • 3 CrossRef citations
  • 0Altmetric

Explore articles

Explore the most recently published articles

Advances in welding sensing information processing and modelling technology: an overview
Amrinder Mehta et al.
Review Article | Published online: 6 Aug 2024
A state-of-the-art review on adhesively bonded joints of similar and dissimilar materials
Naveen Kumar Akkasali et al.
Review Article | Published online: 1 Aug 2024
Influence of dual axial magnetic field and welding parameters on weld characteristics in GTAW process
Paramjeet Shakya et al.
Article | Published online: 1 Aug 2024
Effects of surface roughness parameters on the shear strength of AA 6061-T6 aluminium alloy in structural adhesive bonding applications
Mani Mohan Tiwari et al.
Article | Published online: 24 Jul 2024
View all latest articles