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Articles

Fragmentation testing for ductile thin films on polymer substrates

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Pages 618-624 | Received 18 Mar 2013, Accepted 29 Jul 2013, Published online: 18 Sep 2013

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J. Berger, O. Glushko, V. M. Marx, C. Kirchlechner & M. J. Cordill. (2016) Effect of Microstructure on the Electro-Mechanical Behaviour of Cu Films on Polyimide. JOM 68:6, pages 1640-1646.
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Megan J. Cordill, Julia Berger & Tanja Jörg. (2016) 33-2: Invited Paper : Evaluating Reliability of Flexible Electronic Materials with Combined Electro-Mechanical Testing Techniques . SID Symposium Digest of Technical Papers 47:1, pages 415-418.
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Barbara Putz, Oleksandr Glushko, Vera M. Marx, Christoph Kirchlechner, Daniel Toebbens & Megan J. Cordill. (2016) Electro-mechanical performance of thin gold films on polyimide. MRS Advances 1:12, pages 773-778.
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Barbara Putz, Rachel L. Schoeppner, Oleksandr Glushko, David F. Bahr & Megan J. Cordill. (2015) Improved electro-mechanical performance of gold films on polyimide without adhesion layers. Scripta Materialia 102, pages 23-26.
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Megan J. Cordill, O. Glushko, J. Kreith, V.M. Marx & C. Kirchlechner. (2015) Measuring electro-mechanical properties of thin films on polymer substrates. Microelectronic Engineering 137, pages 96-100.
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M.J. Cordill, V.M. Marx & C. Kirchlechner. (2014) Ductile film delamination from compliant substrates using hard overlayers. Thin Solid Films 571, pages 302-307.
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Patrick Nguyen, Jean-Michel Desmarres, Cedric Seguineau, Joel Alexis & Talal Masri. (2014) A comparative study of microscratch and microtensile adhesion tests for nickel coatings on various substrates. A comparative study of microscratch and microtensile adhesion tests for nickel coatings on various substrates.

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