Citations (23)
Keep up to date with the latest research on this topic with citation updates for this article.
Read on this site (11)
Yue He, Bingbing Li, Yu Shen & Zenglin Wang. (2022) Adhesion improvement of ABS resin by MnO2-H3PO4-H2SO4 colloid with ultrasound-assisted etching treatment. Journal of Adhesion Science and Technology 36:17, pages 1883-1893.
Read now
Read now
Fatemeh Mohtaram, Vahid Mottaghitalab & Gholamreza Baghersalimi. (2017) Development and characterization of flexible antenna based on conductive metal pattern on polyester fabric. The Journal of The Textile Institute 108:11, pages 1888-1898.
Read now
Read now
Wenxia Zhao, Qian Ma, Lisha Li, Xirong Li & Zenglin Wang. (2014) Surface modification of ABS by photocatalytic treatment for electroless copper plating. Journal of Adhesion Science and Technology 28:5, pages 499-511.
Read now
Read now
Wenxia Zhao, Zhixin Li & Zenglin Wang. (2013) A study of the environmentally friendly polycarbonate surface etching system containing H2SO4–MnO2 colloid. Journal of Adhesion Science and Technology 27:13, pages 1455-1463.
Read now
Read now
W X Zhao & Z L Wang. (2013) Adhesion improvement of electroless copper to ABS resin by low environmental pollution surface etching system. Transactions of the IMF 91:3, pages 149-155.
Read now
Read now
X L Yuan, J Gao, Z F Yang, Z X Wang & Z L Wang. (2012) New electroless copper plating bath using sodium hypophosphite as reductant. Surface Engineering 28:5, pages 377-381.
Read now
Read now
X L Yuan, Z F Yang, Y He, Z X Wang & Z L Wang. (2011) Pd-free surface activation technique for ABS surface metallisation. Transactions of the IMF 89:4, pages 202-205.
Read now
Read now
Zhifeng Yang, Yue He, Zhun Li, Na Li & Zenglin Wang. (2011) Adhesion Improvement of ABS Resin to Electroless Copper by H2SO4–MnO2 Colloid with Ultrasound-Assisted Treatment. Journal of Adhesion Science and Technology 25:11, pages 1211-1221.
Read now
Read now
Z.X. Wang, S. Wang, Z. Yang & Z.L. Wang. (2010) Influence of additives and pulse parameters on uniformity of through-hole copper plating. Transactions of the IMF 88:5, pages 272-276.
Read now
Read now
L. Yin, Z. H. Liu, Z. P. Yang, Z. L. Wang & S. Shingubara. (2010) Effect of PEG molecular weight on bottom-up filling of copper electrodeposition for PCB interconnects. Transactions of the IMF 88:3, pages 149-153.
Read now
Read now
A. D. Trigg. (2009) Review – Characterisation and analysis of surface engineered thin films. Transactions of the IMF 87:4, pages 178-192.
Read now
Read now
Articles from other publishers (12)
Xu Wang, Weiwu Ma & Zhangcong Cai. (2023) Colloidal Silver Activation for Electroless Copper Deposition. Surface Engineering and Applied Electrochemistry 59:4, pages 467-472.
Crossref
Crossref
Xiaolong Deng, Jinzhao Huang, Fashen Chen, Hao Wan, Yifan Lin, Xijin Xu, Renzhi Ma & Takayoshi Sasaki. (2019)
In situ
growth of metallic Ag
0
intercalated CoAl layered double hydroxides as efficient electrocatalysts for the oxygen reduction reaction in alkaline solutions
. Dalton Transactions 48:3, pages 1084-1094.
Crossref
Crossref
Wang Xu, Miao Zhuang & Zhang Cheng. (2016) Environmentally Friendly Copper Metallization of ABS by Cu-Catalysed Electroless Process. Rare Metal Materials and Engineering 45:7, pages 1709-1713.
Crossref
Crossref
Y. Ben Amor, I. Frateur, P. Mat & M. Boualam. (2014) Dépôt chimique de nickel : synthèse bibliographique. Matériaux & Techniques 102:1, pages 101.
Crossref
Crossref
Wenxia Zhao, Jie Ding & Zenglin Wang. (2013)
Improvement in the Etching Performance of the Acrylonitrile–Butadiene–Styrene Resin by MnO
2
–H
3
PO
4
–H
2
SO
4
Colloid
. Langmuir 29:20, pages 5968-5973.
Crossref
Crossref
Yong Liao, Shengtao Zhang & Robert Dryfe. (2012) Electroless copper plating using dimethylamine borane as reductant. Particuology 10:4, pages 487-491.
Crossref
Crossref
Xu Wang. (2012) A New Palladium-Free Surface Activation Process for Cu Electroless Plating on ABS Plastic. Advanced Materials Research 548, pages 54-57.
Crossref
Crossref
Zengnian Shu & Xu Wang. (2012) Environment-friendly Pd free surface activation technics for ABS surface. Applied Surface Science 258:14, pages 5328-5331.
Crossref
Crossref
Zenglin Wang, Zhixin Li, Yue He & Zhixiang Wang. (2011) Study of an Environmentally Friendly Surface Etching System of ABS for Improving Adhesion of Electroless Cu film. Journal of The Electrochemical Society 158:11, pages D664.
Crossref
Crossref
Daniela Plana, Andrew I. Campbell, Samson N. Patole, Galyna Shul & Robert A. W. Dryfe. (2010) Kinetics of Electroless Deposition: The Copper−Dimethylamine Borane System. Langmuir 26:12, pages 10334-10340.
Crossref
Crossref
Xu Wang, Na Li, Zhifeng Yang & Zenglin Wang. (2010) Effects of Triethanolamine and K[sub 4][Fe(CN)[sub 6]] upon Electroless Copper Plating. Journal of The Electrochemical Society 157:9, pages D500.
Crossref
Crossref
Zhixin Li, Na Li, Lie Yin, Yue He & Zenglin Wang. (2009) An Environment-Friendly Surface Pretreatment of ABS Resin Prior to Electroless Plating. Electrochemical and Solid-State Letters 12:12, pages D92.
Crossref
Crossref